| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| Layers | 1~40 Layers |
| Base Material | FR4 |
| Origin | Guangdong, China |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Min. Edge Clearance | 3mil |
|---|---|
| Max. Aspect Ratio | 8:1 |
| Min. Solder Mask Dam | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Annular Ring | 3mil |
| Type | PCB Assembly, 94V0 Electronic |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | FR4 |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Material | Complex |
| Insulation Materials | Organic Resin |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
|---|---|
| Impedance Control | ±10% |
| Product Name | HDI PCB Manufacturing |
| Min. Hole Size | 0.2mm |
| Board Thickness | 0.2-3.2mm |
| Model NO | Double Sided PCB-4 |
|---|---|
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Model | FR-4 |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Board Thickness | 0.4-3.2mm |
| Solder Mask | Green/Blue/Red |
