Type | Ceramic PCB Manufacturer |
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Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Type | Consumer Electronics Pcba |
---|---|
Brand Name | GLOBALWILL |
Copper Thickness | Hoz~3oz, Hoz~3oz |
Solder Mask | Green,Black,Blue,Red,Matt Green |
Board Thickness | 0.6mm~10.0mm |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Application | Consumer Electronics |
Type | Custom |
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Place Of Origin | Guangdong, China |
Brand Name | LHD Technology |
Number Of Layers | 1-24 Layers |
Base Material | Fr4/Roger/Polyimide/Metal Base |
Material | FR4 CEM1 CEM3 Hight TG |
---|---|
Base Material | FR-4 |
Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Board Thickness | 0.2mm-6mm(8mil-126mil) |
Min. Hole Size | 0.20mm |
Model Number | FLCA-G125 |
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Type | FPC |
Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Organic Resin |