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Shenzhen Hansion Technology Co., Ltd. 86-0769-81605596 sales@tophspcb.com
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Shenzhen Hansion Technology Co., Ltd. Company Profile

Shenzhen Hansion Technology Co., Ltd.
  • Business Type

    Manufacturer

  • Main Market

    North America,Worldwide,South America,Western Europe,Eastern Europe

  • No. of Employees

    145~150

  • Annual Sales

    7500000-9516000

  • Year Established

    2014

  • Export p.c

    80% - 90%

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86-0769-81605596

Introduction

Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with ​aluminum substrates and ​copper substrates for high-power and high-heat applications. Core Technical Advantages:


✅ ​Exceptional Thermal Performance: Aluminum substrates feature metal-core copper clad technology with thermal conductivity of 1.5–2.0 W/m·K, while copper substrates deliver over 300 W/m·K thermal conductivity, rapidly dissipating heat to ensure equipment stability. 


✅ ​High Reliability: Withstands extreme temperatures (-50°C to 200°C), anti-corrosion, and meets stringent standards for automotive electronics, aerospace, and other harsh environments. 


✅ ​Customizable Designs: Supports thick copper layers (3oz–10oz), irregular cutting, and 3D packaging, ideal for LED lighting, new energy inverters, and high-power power supplies. Applications:


 ✔️ ​LED Lighting: High-power streetlights, stage lights, automotive headlights;


✔️ ​New Energy Vehicles (NEVs): Motor controllers, onboard chargers (OBC);


✔️ ​Industrial Equipment: Inverters, servo drives, solar inverters. Why Choose Us?


✔️ ​Rigorous Quality Control: Fully automated production + 100% thermal cycling testing;


✔️ ​Fast Delivery: Custom small-batch + mass production with 30% shorter lead times;


✔️ ​Cost Optimization: Mature processes + localized supply chain for industry-leading pricing. Empowering High-Power Technology with Metal Substrates! (Contact: Phone/Email/Website) Key Highlights of This Copy:

Focuses on core selling points (thermal performance, extreme environment adaptability);

Targets high-growth industries like NEVs and industrial automation; 

Data-driven (thermal conductivity, temperature range) for credibility; Emphasizes customization and fast delivery to meet industrial client needs.

History

Shenzhen Hansion Technology Co., Ltd.: Shaping the Future of PCB Manufacturing through Innovation


I. Company Overview Founded in 2014 and headquartered in Shenzhen—a global hub for electronic information technology—Shenzhen Hansion Technology Co., Ltd. is a National High-Tech Enterprise specializing in the R&D, production, and SMT (Surface Mount Technology) assembly services of high-precision printed circuit boards (PCBs). Committed to technological innovation, Shenzhen Hansion delivers customized electronic circuit solutions to clients worldwide, serving industries such as telecommunications, automotive electronics, industrial control, and medical devices. 


II. Development Milestones: From Startup to Industry Leader 2014: Rooted in Shenzhen, Embarking on Manufacturing Hanxun was established in Bao’an District, Shenzhen, initially focusing on standard PCB production. With efficient manufacturing management and rigorous quality control, the company quickly gained a foothold in the competitive PCB market. Full automation lines and an ISO 9001 quality management system were implemented, laying the foundation for future growth. 2016: Technological Advancement into Premium Markets To meet the demand for High-Density Interconnect (HDI) boards in smart terminals, Shenzhen Hansion invested in an R&D center, mastering core technologies such as multi-layer lamination and SMT processes. This enabled entry into the supply chains of telecommunications and automotive electronics, with annual production capacity exceeding 200,000 square meters. 2018: Capacity Expansion and Smart Manufacturing Layout The second-phase industrial park in Songshan Lake, Dongguan, was completed, expanding factory space to 8,000 square meters. Advanced German AOI (Automated Optical Inspection) equipment and Japanese SMT machines were introduced, marking a shift toward Industry 4.0. The same year, Shenzhen Hansion obtained IATF 16949 automotive certification, becoming a supplier to BYD and CATL. 2020: Intelligent Transformation and Green Production Shenzhen Hansion launched its "Smart Factory" initiative, deploying MES (Manufacturing Execution Systems) and AI-driven visual inspection platforms. This achieved end-to-end digital order tracking and boosted yield rates to 99.5%. Environmental initiatives earned the company recognition as a "Green Manufacturing Demonstration Enterprise" in Shenzhen. 2023: Vertical Integration and R&D Breakthroughs The establishment of the Shenzhen Hansion Research Institute and collaboration with South China University of Technology on joint labs accelerated advancements in IC substrates and flexible PCBs (FPC). Products now support cutting-edge applications like 5G base stations and Mini LED. Global expansion into Europe, the U.S., and Southeast Asia further broadened the client network. 


III. Technical Expertise and Core Competencies ​Precision Manufacturing: Capable of producing PCBs with line width/space ≤0.05mm, ideal for semiconductor packaging substrates.


​Diverse Product Portfolio: Includes rigid, flexible, rigid-flex, and HDI boards, tailored for 5G communications, EV battery management systems (BMS), and more.


​End-to-End Services: Integrated PCB manufacturing and SMT assembly for streamlined "one-stop" EMS (Electronic Manufacturing Services), reducing delivery cycles. IV. Corporate Social Responsibility and Industry Contributions Shenzhen Hansion prioritizes sustainability, dedicating over 8% of annual revenue to R&D and securing 30+ patents. The company co-drafted the Industry Standard for High-Reliability PCBs and partnered with universities to launch specialized "Smart Manufacturing" training programs, fostering industry talent. V. Future Vision: Empowering the Global Stage with Intelligent Manufacturing On the decade anniversary, Shenzhen Hansion plans to invest 1 billion RMB in building the Anhui Intelligent Manufacturing Base, expanding into IC substrates and semiconductor packaging. Aiming to become a "Global Leader in Electronic Circuit Solutions," the company will continue driving innovation to empower the era of interconnected intelligence. Conclusion From a factory in Shenzhen’s Bao’an District to a globally recognized smart manufacturer, Shenzhen Hansion has written a compelling chapter in China’s PCB industry. Upholding its core values of "Integrity, Excellence, and Win-Win,"Shenzhen Hansionlooks forward to collaborating with partners on new frontiers of the intelligent era.

Service

PCB and PCBA Manufacturing: Precision Engineering, Empowering Future Technologies In the world of electronics, PCBs (Printed Circuit Boards) and PCBA (Printed Circuit Board Assembly) are the silent yet indispensable "skeletons" and "lifeblood." They serve as the foundation for connecting electronic components and enabling functionality, acting as the core carriers for the efficient operation of smart devices. From smartphones and automotive electronics to industrial control systems, these elements are critical to every modern electronic product. Below, explore the production processes and technological value of PCB and PCBA in detail.


​I. PCB Production: The "Skeleton" of Electronic Devices A ​PCB (Printed Circuit Board) is the structural and electrical foundation for mounting electronic components, directly impacting the reliability and stability of electronic devices. Core Production Process: 

1.​Substrate Selection: High-quality materials like FR-4 (epoxy resin fiberglass) or high-frequency materials (e.g., PTFE) are chosen to meet demands for thermal resistance, insulation, and signal transmission.

2.​Pattern Transfer: Photolithography and etching technologies create precise conductive circuit patterns, achieving micron-level accuracy.

3.​Lamination and Drilling: Multi-layer boards are formed through high-temperature lamination, while laser drilling enables high-density interconnect (HDI) designs.

4.​Surface Finish: Processes like immersion gold, OSP, or electroplating enhance solder pad oxidation resistance for reliable welding.

5.​Quality Inspection: AOI (Automated Optical Inspection) and flying probe testing ensure no short circuits or open circuits. Technological Advantages: Supports high-density routing, ideal for 5G communication, IoT, and other high-speed applications. Strict compliance with IPC standards, with AQL sampling inspections to guarantee yield. Combines rapid prototyping with mass production to meet custom client needs.


​II. PCBA Production: Bringing Circuits to Life PCBA (Printed Circuit Board Assembly) involves the placement and soldering of components onto a PCB, transforming it into a functional electronic module. Core Production Process:

1.​SMT (Surface Mount Technology): High-speed pick-and-place machines accurately mount surface-mount components (SMDs) like chips and resistors, achieving ±0.01mm precision.

2.​Reflow Soldering: Controlled thermal profiles melt solder paste, creating durable solder joints for miniaturized, high-density designs.

3.​THT (Through-Hole Technology): Larger components (e.g., connectors) are wave-soldered or selectively soldered for robust connections.

4.​Testing and Calibration: ICT (In-Circuit Testing) verifies electrical performance, while FCT (Functional Testing) ensures real-world functionality.

Shenzhen Hansion Technology Co., Ltd.
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