| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Origin | Guangdong, China |
|---|---|
| Type | Rigid Circuit Board |
| Insulation Materials | Metal Composite Materials |
| Base Material | Copper |
| Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
| Type | Flexible Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 1 Oz |
| Service | One-Stop FPC Assembly |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM |
| Product Name | FPC |
| Quality Assurance | AOI IQC PQC QA |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Model NO. | Rigid-Flex Board |
|---|---|
| Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
| Insulation Materials | Epoxy Resin |
| PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
| Service | PCB, PCBA, SMT, Components |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
