Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | FR4/CEM-1/CEM-3/FR1/aluminum |
Copper Thickness | 3oz |
Board Thickness | 2mm |
Type | Ceramic PCB |
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Place Of Origin | Guangdong, China |
Material | FR4/CEM-1/CEM-3/FR1/aluminum |
Base Material | FR4/aluminum/ceramic |
Copper Thickness | 3oz |
Material | FR4 CEM1 CEM3 Hight TG |
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Base Material | FR-4 |
Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Board Thickness | 0.2mm-6mm(8mil-126mil) |
Min. Hole Size | 0.20mm |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Epoxy Resin |
Flame Retardant Properties | V0 |
Processing Technology | Electrolytic Foil |
Type | Custom |
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Place Of Origin | Guangdong, China |
Brand Name | LHD Technology |
Number Of Layers | 1-24 Layers |
Base Material | Fr4/Roger/Polyimide/Metal Base |
Model Number | FLCA-G125 |
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Type | FPC |
Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Organic Resin |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Model NO | Microcontroller |
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Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
Layer | 1-40 Layer |
Min.Hole Size | 0.1mm (4 Mil) |
Min.Line Spacing | 0.1mm (4 Mil) |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Application | Consumer Electronics |
Type | Ceramic PCB |
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Place Of Origin | Guangdong, China |
Base Material | 96 Aluminum Ceramic |
Material | 96 Aluminum |
Copper Thickness | 0.5-3oz |