| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Copper Thickness | 3oz |
| Board Thickness | 2mm |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 3oz |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Epoxy Resin |
| Flame Retardant Properties | V0 |
| Processing Technology | Electrolytic Foil |
| Type | Custom |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | LHD Technology |
| Number Of Layers | 1-24 Layers |
| Base Material | Fr4/Roger/Polyimide/Metal Base |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
