| Base Material | FR4 (Tg130~Tg170) |
|---|---|
| Insulation Materials | Organic Resin |
| Board Material | Fr4 And Polyimide |
| Layers | 1-40 Layers |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4, Aluminum , CEM, PI |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
| Insulation Materials | Epoxy Resin |
| PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
| Service | PCB, PCBA, SMT, Components |
| Board Thickness | 0.2mm-3.2mm |
|---|---|
| Max. Layer Count | 12-Layer |
| Copper Thickness | 1/2oz-5oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Product Type | Rigid Flex PCB Manufacturing |
| Type | HID PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Polyimide/polyester |
| Copper Thickness | 1oz / 1/2 O Z/ 1/3 Oz, 1OZ |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Name | FPC |
|---|---|
| Base Material | FR-4 |
| Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
| Surface Finishing | Immersion Gold |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1 Oz |
| Min. Hole Size | 0.075 Mm |
| Ntegration | GSIC |
|---|---|
| Technics | Thin Film IC |
| Trademark | OEM |
| Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
| Min. Line Spacing | 0.2mm |
