Base Material | FR4 (Tg130~Tg170) |
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Insulation Materials | Organic Resin |
Board Material | Fr4 And Polyimide |
Layers | 1-40 Layers |
Board Thickness | 1.6mm |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Base Material | FR4, Aluminum , CEM, PI |
Copper Thickness | 1 Oz |
Board Thickness | 1.6mm |
Model NO. | Rigid-Flex Board |
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Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
Insulation Materials | Epoxy Resin |
PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
Service | PCB, PCBA, SMT, Components |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Type | HID PCB |
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Place Of Origin | Guangdong, China |
Base Material | Polyimide/polyester |
Copper Thickness | 1oz / 1/2 O Z/ 1/3 Oz, 1OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Application | Consumer Electronics |
Type | Consumer Electronics PCBA |
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Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Copper Thickness | 1 Oz |
Min. Hole Size | 0.075 Mm |
Ntegration | GSIC |
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Technics | Thin Film IC |
Trademark | OEM |
Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
Min. Line Spacing | 0.2mm |
Model Number | GW-0258 |
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Type | Smart Electronics Pcba |
Brand Name | OEM/ODM |
Supplier Type | Factory/Manufacturer |
Certificate | ISO/TS16949/RoHS/TS16949 |
Type | Motherboard PCBA |
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Product Name | PCBA Circuit Board |
Material | 94v0 |
Copper Thickness | 1/2 Oz-4 Oz |
Base Material | FR-4 |