| Type | Flexible Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 1 Oz |
| Service | One-Stop FPC Assembly |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1 Oz |
| Base Material | FR4 |
| Board Thickness | 1.6mm |
| Ntegration | GSIC |
|---|---|
| Technics | Thin Film IC |
| Trademark | OEM |
| Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
| Min. Line Spacing | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
