| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Insulation Materials | Epoxy Resin |
| Base Material | Aluminum |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Copper Thickness | 3oz |
| Board Thickness | 2mm |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Epoxy Resin |
| Flame Retardant Properties | V0 |
| Processing Technology | Electrolytic Foil |
| Name | OEM/ODM PCB&PCBA |
|---|---|
| Material | FR4,H-TG,Rogers,Ceramics,Aluminium, Copper Base |
| Service | One-stop Service |
| Type | Electronic Board |
| Certificate | ISO/RoHS/TS16949 |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1 Oz |
| Min. Hole Size | 0.075 Mm |
