Place Of Origin | Guangdong, China |
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Type | Multilayer PCB |
Number Of Layers | 1- 24 Layers |
Base Material | FR-4 |
Copper Thickness | 1oz |
Type | Rigid Circuit Board |
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Base Material | Copper |
Base Material | FR-4 |
Layer | 1-40 Layer |
Solder Mask | Green/Blue/Red |
Type | Consumer Electronics Pcba |
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Copper Thickness | 2 OZ, 1/3oz ~6oz |
Min. Hole Size | 0.1mm (4mil) |
Min. Line Spacing | 1/2 Oz. Copper |
Base Material | FR-4 |
Model Number | PCBA-0606 |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Copper Thickness | 1 Oz |
Board Thickness | 1.6mm |
Type | Rigid Circuit Board |
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Origin | Guangdong, China |
Base Material | Copper |
Insulation Materials | Metal Composite Materials |
Min Hole Size | 0.1mm (4 Mil) |
Type | Consumer Electronics PCBA |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy Resin + Polyimide Resin |
Base Material | Aluminum |
Insulation Materials | Metal Composite Materials |
Layer | 1-40 Layer |
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Packaging Details | Foam+Anti-static bags+cartons |
Delivery Time | 2-3 working days |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Epoxy Resin |
Flame Retardant Properties | V0 |
Processing Technology | Electrolytic Foil |
Model NO. | Rigid-Flex Board |
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Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Epoxy Resin |
Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
Base Material | FR4 |
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Layers | 2~40 Layers |
Board Thickness | 0.2mm-6mm |
Min. Hole Size | 0.1-6.5mm |
Min. Line Width | 3mil |