| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | 1-40 Layers |
| Model Number | PCBA-128 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Rogers,Aluminum |
| Copper Thickness | 0.5oz-8oz, 0.5-4oz, Regular 1oz |
| Board Thickness | 0.2mm-4mm, 0.2-4mm, Regular 1.6mm |
| Board Material | Fr4 |
|---|---|
| Board Layer | 1-24 Layers |
| Board Thickness | 0.2mm-6mm |
| Copper Thickness | 0.5oz-2oz |
| Min. Line Width/Space | 0.1mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Brand Name | Customization |
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Surface Finishing | Lead Free HASL/ENIG/OSP |
| Board Thickness | 1.6mm |
