| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Ntegration | GSIC |
|---|---|
| Technics | Thin Film IC |
| Trademark | OEM |
| Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
| Min. Line Spacing | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Polyimide |
| Copper Thickness | 1 Oz |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Consumer Electronics PCBA |
| Copper Thickness | 1oz |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1 Oz |
| Min. Hole Size | 0.075 Mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
