| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Base Material | FR-4 |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Materia | FR-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | Polymide, Fr4 |
| Copper Thickness | 1-6 OZ |
| Min. Hole Size | 0.2mm |
| Model Number | PCBA-0606 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
