| Min. Edge Clearance | 3mil |
|---|---|
| Max. Aspect Ratio | 8:1 |
| Min. Solder Mask Dam | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Annular Ring | 3mil |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Layer Count | 2-12 |
|---|---|
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Dam | 3mil |
| Copper Thickness | 2-6oz |
| Min. Solder Mask Bridge | 3mil |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Copper Thickness | 2-6oz |
| Min. Line Width/Space | 3/3mil |
| Min. Solder Mask Bridge | 3mil |
| Min. Annular Ring | 3mil |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Type | Rigid Circuit Board |
|---|---|
| Material | Fiberglass Epoxy |
| Base Material | FR4 |
| Mechanical Rigid | Rigid |
| Base Material | Copper |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Application | Medical Instruments |
| Base Material | FR4 (Tg130~Tg170) |
