| Type | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties | 94V0 |
| PCB Layers | 1-40 Layers |
| Brand Material | OAK, 3M, Omega |
| Copper Thickness | 0.5-20OZ |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 3oz |
| Origin | Guangdong, China |
|---|---|
| Type | Rigid Circuit Board |
| Insulation Materials | Metal Composite Materials |
| Base Material | Copper |
| Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Application | Medical Instruments |
| Base Material | FR4 (Tg130~Tg170) |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Aluminum |
| Insulation Materials | Epoxy Resin |
| Layer | 1-40 Layer |
| Board Thickness | 0.2-8.0mm |
| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
