| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Customizable |
|---|---|
| Usage | OEM Electronics |
| Base Material | FR4 |
| Min. Line Spacing | 3 Mil (0.075 Mm) |
| Board Thickness | 1.6mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | Polymide, Fr4 |
| Copper Thickness | 1-6 OZ |
| Min. Hole Size | 0.2mm |
| Connector | Type C,USB,Micro USB |
|---|---|
| Dielectric | Fr4/Customized |
| Material | Polyester Glass Fiber Mat Laminate |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Type | Consumer Electronics Pcba |
|---|---|
| Brand Name | Customization |
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | PCBA Contract Manufacturer |
| Material | FR-4 |
| Layer | 1-40 Layers |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM |
| Product Name | FPC |
| Quality Assurance | AOI IQC PQC QA |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
