| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Product Type | Rigid Flex PCB Manufacturing |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Board Size | Max. 600mm X 600mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
| Board Size | Max. 600mm X 600mm |
|---|---|
| Product Type | Rigid Flex PCB Manufacturing |
| Max. Layer Count | 12-Layer |
| Board Material | FR-4, Polyimide, Aluminum |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
|---|---|
| Copper Thickness | 1/2oz-5oz |
| Min. Line Width/Space | 3mil/3mil |
| Board Material | FR-4, Polyimide, Aluminum |
| Board Thickness | 0.2mm-3.2mm |
| Board Thickness | 0.2mm-3.2mm |
|---|---|
| Max. Layer Count | 12-Layer |
| Copper Thickness | 1/2oz-5oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Product Type | Rigid Flex PCB Manufacturing |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | Polymide, Fr4 |
| Copper Thickness | 1-6 OZ |
| Min. Hole Size | 0.2mm |
