| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Layer | 1-40 Layer |
|---|---|
| Packaging Details | Foam+Anti-static bags+cartons |
| Delivery Time | 2-3 working days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
