| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | 1-40 Layers |
| Model Number | PCBA-128 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Rogers,Aluminum |
| Copper Thickness | 0.5oz-8oz, 0.5-4oz, Regular 1oz |
| Board Thickness | 0.2mm-4mm, 0.2-4mm, Regular 1.6mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Type | Multilayer PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Material | FR4 CEM1 CEM3 Hight TG |
| Copper Thickness | 0.5OZ--6 OZ |
| Model Number | GL-2165 |
|---|---|
| Type | Home Appliance Pcba |
| Copper Thickness 4 Oz | 4 Oz |
| Service | PCB Fabrication, Compoennts Sourcing, PCB Assembly |
| Testing Service | AOI , Functional Testing ,flying Probe Testing, E-testing |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Copper Thickness | 2-6oz |
| Min. Line Width/Space | 3/3mil |
| Min. Solder Mask Bridge | 3mil |
| Min. Annular Ring | 3mil |
| Board Material | Fr4 |
|---|---|
| Board Layer | 1-24 Layers |
| Board Thickness | 0.2mm-6mm |
| Copper Thickness | 0.5oz-2oz |
| Min. Line Width/Space | 0.1mm |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
