| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm~3.0mm |
| Min. Hole Size | 0.10mm |
| Type | Multilayer PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Material | FR4 CEM1 CEM3 Hight TG |
| Copper Thickness | 0.5OZ--6 OZ |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM |
| Product Name | FPC |
| Quality Assurance | AOI IQC PQC QA |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| SSupplier Type | Wholesale |
|---|---|
| Origin | Guangdong, China |
| Copper Thickness | OEM |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Surface Finishing | Lead Free HASL/ENIG/OSP |
| Board Thickness | 1.6mm |
| Type | Customizable |
|---|---|
| Usage | OEM Electronics |
| Base Material | FR4 |
| Min. Line Spacing | 3 Mil (0.075 Mm) |
| Board Thickness | 1.6mm |
