| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Layer | 1-40 Layer |
|---|---|
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties | 94V0 |
| PCB Layers | 1-40 Layers |
| Brand Material | OAK, 3M, Omega |
| Copper Thickness | 0.5-20OZ |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Base Material | FR4 |
|---|---|
| Board Thickness | 0.2-6.0mm |
| Surface Finishing | HASL/OSP Etc |
| Min. Line Spacing | 0.2mm |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1 Oz |
| Base Material | FR4 |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
