| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 24 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | PCB Assembly Manufacturer |
| Copper Thickness | 3 Oz |
| Solder Mask Color | Blue.green.red.black.white |
| Surface Finishing | HASL\OSP\immersion Gold |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | FR-4, Fr-4,cem-1,cem-3 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Base Material | FR4 |
|---|---|
| Layers | 2~40 Layers |
| Board Thickness | 0.2mm-6mm |
| Min. Hole Size | 0.1-6.5mm |
| Min. Line Width | 3mil |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Copper Thickness | 3oz |
| Board Thickness | 2mm |
