| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Application | Medical Instruments |
| Base Material | FR4 (Tg130~Tg170) |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Typy | Ceramic PCB , Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Rogers,Aluminum |
| Copper Thickness | 0.5oz-8oz |
| Board Thickness | 0.2mm-4mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Copper Thickness | 3oz |
| Board Thickness | 2mm |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Insulation Materials | Epoxy Resin |
| Base Material | Aluminum |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Usage | OEM Electronics |
| Material | FR-4 |
