| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Flexible Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 1 Oz |
| Service | One-Stop FPC Assembly |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | OEM/ODM |
| Base Material | FR4 |
| Copper Thickness | 0.5-5 OZ |
| Type | Rigid Circuit Board |
|---|---|
| Material | Fiberglass Epoxy |
| Base Material | FR4 |
| Mechanical Rigid | Rigid |
| Base Material | Copper |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Application | Electronics Device |
| Custom | OEM/ODM |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
