Model NO. | Rigid-Flex Board |
---|---|
Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Epoxy Resin |
Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
Type | Heavy Copper PCB |
---|---|
Place Of Origin | Guangdong, China |
Base Material | Aluminum |
Copper Thickness | 3u |
Board Thickness | 0.2mm~3.0mm |
Type | Rigid Circuit Board |
---|---|
Origin | Guangdong, China |
Base Material | Copper |
Insulation Materials | Metal Composite Materials |
Min Hole Size | 0.1mm (4 Mil) |
Type | Consumer Electronics PCBA |
---|---|
Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Usage | OEM Electronics |
Material | FR-4 |
Origin | Guangdong, China |
---|---|
Type | Rigid Circuit Board |
Insulation Materials | Metal Composite Materials |
Base Material | Copper |
Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
Type | Rigid Circuit Board |
---|---|
Place Of Origin | Guangdong, China |
Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
Copper Thickness | 1OZ |
Board Thickness | 1.6mm |
Place Of Origin | Guangdong, China |
---|---|
Base Material | FR4 Pcb |
Copper Thickness | 1oz |
Board Thickness | 1.6mm |
Min. Hole Size | 0.3mm |
Type | Consumer Electronics PCBA |
---|---|
Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
Base Material | FR4 |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
---|---|
Min. Line Spacing | 0.1mm/4mil |
Min. Hole Size | 0.1mm-1mm |
Surface Finishing | HASL,Gold Plating |
Product Name | Electronic Boards |
Type | Rigid Circuit Board |
---|---|
Origin | Guangdong, China |
Mechanical Rigid | Rigid |
Material | Fiberglass Epoxy |
Board Material | Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base |