| Type | Consumer Electronics PCBA / USB Board |
|---|---|
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Solder Mask Color | Yellow;Black;White |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Origin | Guangdong, China |
|---|---|
| Type | Rigid Circuit Board |
| Insulation Materials | Metal Composite Materials |
| Base Material | Copper |
| Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Custom |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | LHD Technology |
| Number Of Layers | 1-24 Layers |
| Base Material | Fr4/Roger/Polyimide/Metal Base |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Rigid Circuit Board |
|---|---|
| Surface Finishing | HASL |
| Copper Thickness | 1oz |
| HS Code | 8534009000 |
| Test | Customer's Test Method |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
