| Base Material | FR4 (Tg130~Tg170) |
|---|---|
| Insulation Materials | Organic Resin |
| Board Material | Fr4 And Polyimide |
| Layers | 1-40 Layers |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4, Aluminum , CEM, PI |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Type | Multilayer PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Number Of Layers | 1- 40 Layers |
| Base Material | FR4 |
| Copper Thickness | 0.5-2oz |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | OEM/ODM |
| Base Material | FR4 |
| Copper Thickness | 0.5-5 OZ |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Rigid Circuit Board |
|---|---|
| Material | Fiberglass Epoxy |
| Base Material | FR4 |
| Mechanical Rigid | Rigid |
| Base Material | Copper |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
