| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm~3.0mm |
| Min. Hole Size | 0.10mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Fr4, Any Specialized Material As Per Your Choice |
| Copper Thickness | 0.3- 6 OZ |
| Board Thickness | 0.3mm-3.2mm |
| Min. Hole Size | 0.20mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
| Type | Power Bank PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
| SSupplier Type | OEM/ODM |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Insulation Materials | Epoxy Resin |
| Base Material | Aluminum |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| SSupplier Type | Wholesale |
|---|---|
| Origin | Guangdong, China |
| Copper Thickness | OEM |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
