| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm-4.5mm |
| Min. Edge Clearance | 3mil |
|---|---|
| Max. Aspect Ratio | 8:1 |
| Min. Solder Mask Dam | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Annular Ring | 3mil |
| Min Hole Size | 0.2mm |
|---|---|
| Testing | Flying Probe Test |
| Min Line Width | 0.1mm |
| Material | FR4 |
| Board Thickness | 1.6mm |
| Board Thickness | 0.2mm-3.2mm |
|---|---|
| Max. Layer Count | 12-Layer |
| Copper Thickness | 1/2oz-5oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
|---|---|
| Copper Thickness | 1/2oz-5oz |
| Min. Line Width/Space | 3mil/3mil |
| Board Material | FR-4, Polyimide, Aluminum |
| Board Thickness | 0.2mm-3.2mm |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
|---|---|
| Impedance Control | ±10% |
| Product Name | HDI PCB Manufacturing |
| Min. Hole Size | 0.2mm |
| Board Thickness | 0.2-3.2mm |
| Board Thickness | 0.2-3.2mm |
|---|---|
| Surface Finish | HASL,ENIG,OSP,Immersion Gold,Immersion Tin,Immersion Silver |
| Warranty | 5 Year |
| Copper Thickness | 1/2oz-6oz |
| Silkscreen Color | White,Black,Yellow |
