| Type | FPC, Dual Sides |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-0.2mm |
| Surface Finishing | HASL,Immersion Gold,ENIG |
| Base Material | PI |
| Brand Name | POE |
|---|---|
| Base Material | FR4 |
| Copper Thickness | 1oz |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.2mm |
| Brand Name | OEM/ODM |
|---|---|
| Model Number | RZY-Q108 |
| Material Types | FR4, Rogers, Aluminum Based, Isola, PI |
| Copper Thickness | 1 Oz |
| Board Thickness | 0.2mm |
| Model NO | Double Sided PCB-4 |
|---|---|
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Model | FR-4 |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Board Thickness | 0.4-3.2mm |
| Solder Mask | Green/Blue/Red |
| Layer | 1-40 Layer |
|---|---|
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
