| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Layer | 1-40 Layer |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | 96 Aluminum Ceramic |
| Material | 96 Aluminum |
| Copper Thickness | 0.5-3oz |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | FR4 ,Any Specialized Material As Per Your Choice |
| Copper Thickness | 0.3- 6 OZ |
| Board Thickness | 0.3 Mm- 4 Mm |
| Min. Hole Size | 0.20mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | PCB Assembly Manufacturer |
| Copper Thickness | 3 Oz |
| Solder Mask Color | Blue.green.red.black.white |
| Surface Finishing | HASL\OSP\immersion Gold |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Fr4, Any Specialized Material As Per Your Choice |
| Copper Thickness | 0.3- 6 OZ |
| Board Thickness | 0.3mm-3.2mm |
| Min. Hole Size | 0.20mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | OEM PCBA |
| Copper Thickness | 0.5-6oz |
| Application | Electronics Device |
| Material | FR4 CEM1 CEM3 Hight TG |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | 1-40 Layers |
