Base Material | FR4 (Tg130~Tg170) |
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Insulation Materials | Organic Resin |
Board Material | Fr4 And Polyimide |
Layers | 1-40 Layers |
Board Thickness | 1.6mm |
Type | Rigid Circuit Board |
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Origin | Guangdong, China |
Base Material | Copper |
Insulation Materials | Metal Composite Materials |
Min Hole Size | 0.1mm (4 Mil) |
SSupplier Type | Wholesale |
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Origin | Guangdong, China |
Copper Thickness | OEM |
Material | Paper Phenolic Copper Foil Substrate |
Base Material | Copper |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Surface Finishing | Lead Free HASL/ENIG/OSP |
Board Thickness | 1.6mm |
Name | PCB & PCBA Design |
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Supplier Type | Finished Product |
Place Of Origin | Guangdong, China |
Item | Customized Pcba Design Services |
Service | One Stop Service |
Model NO | Double Sided PCB-4 |
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Base Material | Fr-4 |
Insulation Materials | Organic Resin |
Model | FR-4 |
Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
Type | Consumer Electronics Pcba |
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Brand Name | Customize |
Surface Finishing | Lead-free HASL |
Copper Thickness | 1oz |
Solder Mask Color | Green Black Bule White |