| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| Layers | 1~40 Layers |
| Base Material | FR4 |
| Origin | Guangdong, China |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Board Thickness | 0.2-3.2mm |
|---|---|
| Min. Line Width | 3mil |
| Layer Count | 4-20 |
| Impedance Control | ±10% |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Insulation Materials | Epoxy Resin |
| Base Material | Aluminum |
| Name | OEM/ODM PCB&PCBA |
|---|---|
| Material | FR4,H-TG,Rogers,Ceramics,Aluminium, Copper Base |
| Service | One-stop Service |
| Type | Electronic Board |
| Certificate | ISO/RoHS/TS16949 |
| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
| Mode Of Production | SMT |
|---|---|
| Metal Coating | Copper |
| Layers | Multilayer |
| Customized | Customized |
| Base Material | FR-4 |
