| Warranty | 5 Year |
|---|---|
| Material | FR4 |
| Board Thickness | 0.2-3.2mm |
| Min. Hole Size | 0.2mm |
| Copper Thickness | 1/2oz-6oz |
| Surface Finish | HASL,ENIG,OSP,Immersion Gold,Immersion Tin,Immersion Silver |
|---|---|
| Product Name | One Stop PCB Assembly |
| Board Thickness | 0.2-3.2mm |
| Min. Line Spacing | 0.1mm |
| Material | FR4 |
| Copper Thickness | 1/2oz-6oz |
|---|---|
| Surface Finish | HASL,ENIG,OSP,Immersion Gold,Immersion Tin,Immersion Silver |
| Material | FR4 |
| Layer | 2-20 Layers |
| Product Name | One Stop PCB Assembly |
| Min. Edge Clearance | 3mil |
|---|---|
| Max. Aspect Ratio | 8:1 |
| Min. Solder Mask Dam | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Annular Ring | 3mil |
| Board Thickness | 0.2-3.2mm |
|---|---|
| Type | PCB Assembly |
| Material | FR4 |
| Min. Line Spacing | 0.1mm |
| Warranty | 5 Year |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Copper Thickness | 2-6oz |
| Min. Line Width/Space | 3/3mil |
| Min. Solder Mask Bridge | 3mil |
| Min. Annular Ring | 3mil |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Board Thickness | 0.2-3.2mm |
|---|---|
| Min. Line Width | 3mil |
| Layer Count | 4-20 |
| Impedance Control | ±10% |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
|---|---|
| Impedance Control | ±10% |
| Product Name | HDI PCB Manufacturing |
| Min. Hole Size | 0.2mm |
| Board Thickness | 0.2-3.2mm |
