| Model NO. | Rigid-Flex Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Mechanical Rigid | Rigid |
| Layer | 1-40 Layer |
| Place Of Origin | Guangdong, China |
|---|---|
| Insulation Materials | Epoxy Resin |
| Stiffener Material | Pi |
| Copper Thickness For Inner Layers | 20 Oz |
| Surface Finishing | ENIG,HASL,OSP,ENEPIG,Flash Gold |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm-4.5mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
|---|---|
| Copper Thickness | 1/2oz-5oz |
| Min. Line Width/Space | 3mil/3mil |
| Board Material | FR-4, Polyimide, Aluminum |
| Board Thickness | 0.2mm-3.2mm |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | OEM/ODM |
| Base Material | FR4 |
| Copper Thickness | 0.5-5 OZ |
| Product Type | Rigid Flex PCB Manufacturing |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Board Size | Max. 600mm X 600mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
|---|---|
| Impedance Control | ±10% |
| Product Name | HDI PCB Manufacturing |
| Min. Hole Size | 0.2mm |
| Board Thickness | 0.2-3.2mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Type | Consumer Electronics PCBA, USB Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Keywords | OEM Contract Manufacturing PCB |
