| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Model Number | Custom PCB & PCB Assembly |
|---|---|
| Supplier Type | OEM |
| Product Name | Mechanical Keyboard |
| Capacity | Hotswap, USB Type-C, Kailh Socket, LED |
| Speed | 0.15sec/chip,0.7sec/QFR |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | OEM |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| MOQ | 1 PCS |
| Service | One-Stop OEM Service |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Epoxy Resin |
| Flame Retardant Properties | V0 |
| Processing Technology | Electrolytic Foil |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| PCB/PCBA Max Size | 400*310mm |
| Production Lines | SMT &DIP Production Lines , Assembly Lines |
| Layers | Double-Layer |
| Model Number | Multilayer Pcba |
|---|---|
| Type | Consumer Electronics Pcba |
| Brand Name | OEM |
| Supplier Type | Multilayer Pcba Manufacture |
| Copper Thickness | 1 Oz |
