| Base Material | FR4 |
|---|---|
| Board Thickness | 0.2-6.0mm |
| Surface Finishing | HASL/OSP Etc |
| Min. Line Spacing | 0.2mm |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
| Base Material | FR4 |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Polyester Glass Fiber Mat Laminate |
| Processing Technology | Electrolytic Foil |
| Application | Consumer Electronics |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Layer | 1-40 Layer |
| Solder Mask | Green/Blue/Red |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | One Stop Turnkey Service |
| Surface Finishing | HAL, HASL Lead Free |
| Base Material | FR-4 |
| Base Material | FR4 |
|---|---|
| Layers | 2~40 Layers |
| Board Thickness | 0.2mm-6mm |
| Min. Hole Size | 0.1-6.5mm |
| Min. Line Width | 3mil |
