| Layer | 1-40 Layer |
|---|---|
| Packaging Details | Foam+Anti-static bags+cartons |
| Delivery Time | 2-3 working days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
| Base Material | FR-4 |
|---|---|
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2 -3 Mm |
| Min. Hole Size | 0.20mm |
| Min. Line Width | 4mil |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Min. Line Spacing | 0.1mm |
| Copper Thickness | 1-6 Oz |
| Silkscreen Color | White, Black, Yellow |
|---|---|
| Copper Thickness | 1/2oz-6oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Gold Plating |
| Product Name | HDI PCB Manufacturing |
| Solder Mask Color | Green, Blue, White, Black, Red, Yellow |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| FPC Layer | 1-8 Layers |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Min. Hole Size | 0.20mm |
| Board Size | Max. 600mm X 600mm |
|---|---|
| Product Type | Rigid Flex PCB Manufacturing |
| Max. Layer Count | 12-Layer |
| Board Material | FR-4, Polyimide, Aluminum |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Connector | Type C,USB,Micro USB |
|---|---|
| Dielectric | Fr4/Customized |
| Material | Polyester Glass Fiber Mat Laminate |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Insulation Materials | Epoxy Resin |
| Base Material | Aluminum |
