Type | Rigid Circuit Board |
---|---|
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Base Material | Copper |
Insulation Materials | Organic Resin |
Model NO | Microcontroller |
---|---|
Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
Layer | 1-40 Layer |
Min.Hole Size | 0.1mm (4 Mil) |
Min.Line Spacing | 0.1mm (4 Mil) |
Layer | 1-40 Layer |
---|---|
Packaging Details | Foam+Anti-static bags+cartons |
Delivery Time | 2-3 working days |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
Type | Rigid Circuit Board |
---|---|
Processing Technology | Electrolytic Foil |
Base Material | FR-4 |
Surface Finishing | HASL Lead Free |
Copper Thickness | 1oz |