Origin | Guangdong, China |
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Metal Coating | Copper |
Mode Of Production | SMT / DIP |
Base Material | FR-4 |
Layers | 1-40 Layers |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Base Material | Copper |
Insulation Materials | Organic Resin |
Supplier Type | Customized |
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Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Base Material | FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 0.5~3.2mm |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
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Base Material | CEM-1 OR FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 0.5~3.2mm |
Min. Line Width | 0.1mm/4mi |
Model Number | OEM/ODM/EMS |
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Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
Copper Thickness | 0.5-4 Oz |
Board Thickness | 1.6mm |
Min. Hole Size | 0.1mm |
Type | PCB Assembly, 94V0 Electronic |
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Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Material | FR4 CEM1 CEM3 Hight TG |
Base Material | FR4 |
Material | FR4 CEM1 CEM3 Hight TG |
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Base Material | FR-4 |
Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Board Thickness | 0.2mm-6mm(8mil-126mil) |
Min. Hole Size | 0.20mm |
Type | Consumer Electronics Pcba |
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Supplier Type | PCB,PCBA,FPC,HDI,RFPC |
Silkscreen Color | Black, White, Red, Green |
Material | FR4 CEM1 CEM3 Hight TG |
Service | One-stop Turnkey Service |
Connector | Type C,USB,Micro USB |
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Dielectric | Fr4/Customized |
Material | Polyester Glass Fiber Mat Laminate |
Base Material | Copper |
Insulation Materials | Epoxy Resin |
Model NO | Microcontroller |
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Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
Layer | 1-40 Layer |
Min.Hole Size | 0.1mm (4 Mil) |
Min.Line Spacing | 0.1mm (4 Mil) |