Universal Inverter Washing Machine Control Board Green Solder Mask PCB FR4 For Samsung LG
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Highlight
Universal Inverter Washing Machine Control Board
,Green Solder Mask PCB FR4
,Green Solder Mask Washing Machine PCB
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Min. Trace Width/Spacing0.1mm/0.1mm
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ApplicationConsumer Electronics, Industrial Control, Medical Equipment, Automotive, Telecommunication
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Copper Thickness0.5oz-6oz
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MaterialFR4
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Lead Time1-3 Weeks
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Max. Panel Size600mm X 1200mm
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Board Thickness0.2mm-7.0mm
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Surface FinishHASL, ENIG, OSP, Immersion Silver, Immersion Tin
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Min. Hole Size0.2mm
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Brand NameHansion
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Model NumberFR4 double side PCBA
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Minimum Order Quantity1
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Price5
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Packaging Detailsfoam+custom box
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Delivery Time3-5days
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Payment TermsWestern Union,T/T
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Supply Ability10000PCS per month
Universal Inverter Washing Machine Control Board Green Solder Mask PCB FR4 For Samsung LG
Universal Inverter Washing Machine Control Board PCB OEM Green Solder Mask FR-4 Base Material for Samsung LG Sharp Toshiba
Product Paramenters
PCB Capability
Number of Layer : 1 - 20 Layer Maximum Processing Area : 680 × 1000MM
Material : FR1, 22F, CEM-1, CEM-3, FR4,
High TG, Aluminum, Ceramic, Rogers
2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
Min Board Thickness : 10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM (59 mil )
16 Layer - 1.6MM ( 63 mil )
18Layer - 1.8MM ( 71 mil )
Thickness: ≤ 1.0MM,
Finished Board Tolerance:±0.1MM
Thickness Tolerance : 1.0MM≤Thickness≤6.5MM
Tolerance ± 10%
Twisting and Bending : ≤ 0.75%, Min: 0.5%
Range of TG : 130 - 215 ℃
Impedance Tolerance : ±10%, Min: ± 5%
Hi-Pot TestMax : 4000V/10MA/60S
HASL, With Lead
HASL Free Lead
Flash Gold
Surface Treatment : Immersion Gold
Immersion Silver
Immersion Tin
Gold Finger
OSP
PCB Assmbly Capability
Order Quantity : 1pc – 10,000,000+pcs Build Time : 1 – 5 days, 1 – 2 weeks or scheduled deliveries PCB whose width/length is less
than 30mm should be panelized PCB Spec Requirements : Max board size: 500×450 mm Board Type: Rigid PCBs, Flexible
PCBs, Metal core PCBs
Surface mount, Thro-hole
Mixed technology (SMT & Thru-hole) Assembly Types : Single or double sided placement Conformal coating Shield cover assembly for
EMI
emission control
Solder Type : Lead-free – RoHS Full Turnkey Parts Procurement : Partial Turnkey Kitted/Consigned SMT 01005 or larger BGA 0.4mm
pitch, POP (Package on
Component types : Package), WLCSP 0.35mm pitch Hard metric connectors,Cable&wire SMT Parts Presentation : Bulk, Cut tape, Partial
reel, Reel
Tube, Tray Stencils : Laser-cut stainless steel Free DFM Review, Box Build Assembly Other Techniques : 100% AOI test and X-ray
test for BGA IC programming, Components cost-down Function test as custom, Protection tech.
Number of Layer : 1 - 20 Layer Maximum Processing Area : 680 × 1000MM
Material : FR1, 22F, CEM-1, CEM-3, FR4,
High TG, Aluminum, Ceramic, Rogers
2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
Min Board Thickness : 10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM (59 mil )
16 Layer - 1.6MM ( 63 mil )
18Layer - 1.8MM ( 71 mil )
Thickness: ≤ 1.0MM,
Finished Board Tolerance:±0.1MM
Thickness Tolerance : 1.0MM≤Thickness≤6.5MM
Tolerance ± 10%
Twisting and Bending : ≤ 0.75%, Min: 0.5%
Range of TG : 130 - 215 ℃
Impedance Tolerance : ±10%, Min: ± 5%
Hi-Pot TestMax : 4000V/10MA/60S
HASL, With Lead
HASL Free Lead
Flash Gold
Surface Treatment : Immersion Gold
Immersion Silver
Immersion Tin
Gold Finger
OSP
PCB Assmbly Capability
Order Quantity : 1pc – 10,000,000+pcs Build Time : 1 – 5 days, 1 – 2 weeks or scheduled deliveries PCB whose width/length is less
than 30mm should be panelized PCB Spec Requirements : Max board size: 500×450 mm Board Type: Rigid PCBs, Flexible
PCBs, Metal core PCBs
Surface mount, Thro-hole
Mixed technology (SMT & Thru-hole) Assembly Types : Single or double sided placement Conformal coating Shield cover assembly for
EMI
emission control
Solder Type : Lead-free – RoHS Full Turnkey Parts Procurement : Partial Turnkey Kitted/Consigned SMT 01005 or larger BGA 0.4mm
pitch, POP (Package on
Component types : Package), WLCSP 0.35mm pitch Hard metric connectors,Cable&wire SMT Parts Presentation : Bulk, Cut tape, Partial
reel, Reel
Tube, Tray Stencils : Laser-cut stainless steel Free DFM Review, Box Build Assembly Other Techniques : 100% AOI test and X-ray
test for BGA IC programming, Components cost-down Function test as custom, Protection tech.
PCB Quotation Terms
1. Gerber File(include complete circuit files, drilling files, outline files etc.) 2. Quantity ( pcs or set )
3. Deadline
4. Transport
5. Specification(include Layers Count, Finished Board Thickness, Panel Size, Surface Finishing,Impedance Control, Gold
Finger,Stack-up etc.)
PCBA Quotation Terms
1. Gerber File(include complete circuit files, drilling files, outline files etc.)
2. Coordinate file
3. BOM file (bill of materials)
4. Quantity ( pcs or set )
5. Deadline
6. Specification(include Layers Count, Finished Board Thickness, Panel Size, Surface Finishing, Impedance Control, Gold
Finger,Stack-up etc.)
7. Transport: Which mode of transportation do you want ( FOB, DDP, DDU etc..
1. Gerber File(include complete circuit files, drilling files, outline files etc.) 2. Quantity ( pcs or set )
3. Deadline
4. Transport
5. Specification(include Layers Count, Finished Board Thickness, Panel Size, Surface Finishing,Impedance Control, Gold
Finger,Stack-up etc.)
PCBA Quotation Terms
1. Gerber File(include complete circuit files, drilling files, outline files etc.)
2. Coordinate file
3. BOM file (bill of materials)
4. Quantity ( pcs or set )
5. Deadline
6. Specification(include Layers Count, Finished Board Thickness, Panel Size, Surface Finishing, Impedance Control, Gold
Finger,Stack-up etc.)
7. Transport: Which mode of transportation do you want ( FOB, DDP, DDU etc..
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