IPC-III Standard PCB Circuit Board Assembly Smart Watch 0.076mm Buried Cpacitor
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IPC-III PCB Circuit Board Assembly
,PCB Circuit Board Assembly 0.076mm
,Circuit Board Assembly Buried Cpacitor
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Model NumberGW-0258
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TypeSmart Electronics Pcba
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Brand NameOEM/ODM
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Supplier TypeFactory/Manufacturer
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CertificateISO/TS16949/RoHS/TS16949
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Layer1-24 Layers
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Solder MaskGreen Black Bule White
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Silkscreen ColorWhite Black
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PCB StandardIPC-A-610 D/IPC-III Standard
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Hole TolerancePTH: ±2mil, NTPH: ±2mil
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Board Thickness Tolerance±10%
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Layer1-40 Layer
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Place of OriginGuangdong, China
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Brand NameGW-PCBA
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CertificationISO/TS16949/RoHS/TS16949
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Model NumberGW-0258
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Minimum Order Quantity1PCS
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PriceUSD+0.1-6+per pcs
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Packaging DetailsVacumn packing for bare board, standand cartons outside for shipping
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Delivery TimePCB 3-7dyas, PCBA 1-3weeks/1 - 1000 -15days；1001 - 5000-20days；5001 - 20000-35days
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Payment TermsL/C, D/A, D/P, T/T, Western Union, MoneyGram
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Supply Ability30000 Square Meter/Square Meters per Month module electronic board
IPC-III Standard PCB Circuit Board Assembly Smart Watch 0.076mm Buried Cpacitor
Product Description
Electronic Pcba Manufacturer Smart Watch Pcb Circuit Board Assembly
| Technology Capabilities | |
|---|---|
| Layer | 1~22L |
| Min.inner Layer Trace | 0.076mm |
| Min.inner layer Space | 0.076mm |
| Min.outer Layer Trace | 0.076mm |
| Min.outer Layer Trace | 0.076mm |
| Max.inner layer copper Thickness | 6oz |
| Max.outer layer copper Thickness | 14oz |
| Layer to Layer registration tolerance <10L | +/-0.076mm |
| Layer to Layer registration tolerance >10L | +/-0.125mm |
| Max.Finished board thickness | 8mm |
| Min.Finished board thickness | 0.3mm |
| Min.Core Dielectric thickness | 0.051mm |
| Min.Impedance-Differential | +/-5% |
| HDI Stack up | 1+N+1,2+N+2,3+N+3 |
| Controlled Depth Drilling Tolerance | +/-0.1mm |
| Advanced | Buried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base |
| Max Production Panel Size | 24.5"*43" |
| Via in PAD | YES |
| BGA Pitch(with trace) | 0.4mm |
| Soldermask Registration | +/-0.03mm |
| Min.Solder Dam | 0.064mm |
| Min.Drilled Hole size-Mechanical | 0.2mm |
| Min.Drilled Hole size-Laser | 0.1mm |
| Max.Laser Drill Aspect Ratio | 20:01 |
| Press Fit Hole | +/-0.05mm |
| Layer To layer Registration Tolerance | 0.04mm |
| Min.Dielectric Thickness | 0.04mm |
| Controlled Depth Drilling | YES |
| BGA Pitch(with trace) | 0.5mm |
| surface Finishing | ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold, |
| Materil | Normal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminate |
PCBA Flow:
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