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Shenzhen Hansion Technology Co., Ltd. 86-0769-81605596 sales@tophspcb.com
Customization Multilayer PCB Circuit Board HDI And High Density Interconnects

Customization Multilayer PCB Circuit Board HDI And High Density Interconnects

  • Highlight

    Customization Multilayer PCB Circuit Board

    ,

    High Density Interconnects PCB Circuit Board

    ,

    Customization multilayer pcb fabrication

  • Silkscreen Color
    White, Black, Yellow
  • Material
    FR4
  • Minimum Trace/Space
    4/4 Mil
  • Copper Thickness
    1/2 Oz, 1 Oz, 2 Oz
  • Surface Finish
    HASL, ENIG, OSP, Immersion Silver, Immersion Tin
  • Layer
    2-16 Layers
  • Minimum Hole Size
    0.2 Mm
  • Solder Mask Color
    Green, Blue, Black, Red, Yellow, White
  • Product Name
    HS-FR4 PCBA 001
  • Place of Origin
    China
  • Brand Name
    Hansion
  • Model Number
    FR4 double side PCBA
  • Minimum Order Quantity
    1
  • Price
    5
  • Packaging Details
    foam+custom box
  • Delivery Time
    3-5days
  • Payment Terms
    Western Union,T/T
  • Supply Ability
    10000PCS per month

Customization Multilayer PCB Circuit Board HDI And High Density Interconnects

Description
Technology & Capabilities
1. Product Range
Rigid PCBs from 2- 24 layers, HDI; Aluminium base
2. Min. Board Thickness
2 layer
4 layer
6 layer
8 layer
10 layer
min. 0.2 mm
0.4 mm
1 mm
1.2 mm
1.5 mm
12 & 14 layer
16 layer
18 layer
20 layer
22 & 24 layer
1.6 mm
1.7 mm
1.8 mm
2.2 mm
2.6 mm
3. Max. Board Size
610 x 1200 mm
4. Base Material
FR-4 Glass Epoxy laminate, Aluminium base, RCC
5. Surface Finish Treatment
Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic)
6. Major Laminate
King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others.
7. Via Holes
Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH
8. Copper Foil Thickness
18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz)
18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz)
9. Min. Via Size and Type
Dia. 0.15mm (Finished).
Aspect Ratiao = 12; HDI holes (<0.10mm)
10. Min. Line Width & Spacing
0.75 mm/ 0.10mm ( 3mil/ 4mil)
11. Min Via Hole Size & Pad
Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via
12. Impedance I Control Tol.
+/- 10% ( min. +/- 7 Ohm)
13. Solder Mask
Liquid Photo- Image (LPI)
14.  Profiling
CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering
15.  Capacity
100 k㎡ output monthly

 

 

FAQ:

Question 1.Are you pcba factory?

Answer:yes of course.

Question 2:Does your factory provide one stop service?

Answer:Yes of course we have purchase department and designer.

Question 4:can you provide me sample to test before mass order?

Answer:Yes of course

Question 5:how about your package?are you sure that i will receive the prefect goods without damage?

Answer:we provide custom foam box to protect the product.