| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties | 94V0 |
| PCB Layers | 1-40 Layers |
| Brand Material | OAK, 3M, Omega |
| Copper Thickness | 0.5-20OZ |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Type | Consumer Electronics PCBA / USB Board |
|---|---|
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Solder Mask Color | Yellow;Black;White |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 1.6mm |
| Board Size | Max. 600mm X 600mm |
|---|---|
| Product Type | Rigid Flex PCB Manufacturing |
| Max. Layer Count | 12-Layer |
| Board Material | FR-4, Polyimide, Aluminum |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Layer | 1-40 Layer |
|---|---|
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Type | PBC-025 |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Product Name | Pcb Board Component |
| Base Material | FR-4 |
| Board Thickness | 0.4~3mm |
| Base Material | FR4 |
|---|---|
| Board Thickness | 0.2-6.0mm |
| Surface Finishing | HASL/OSP Etc |
| Min. Line Spacing | 0.2mm |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
