| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Model NO | Double Sided PCB-4 |
|---|---|
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Model | FR-4 |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1oz |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Model Number | PCBA-0606 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Type | Consumer Electronics PCBA / USB Board |
|---|---|
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Solder Mask Color | Yellow;Black;White |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
