| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Base Material | FR4 |
| Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | OEM/ODM |
| Base Material | FR4 |
| Copper Thickness | 0.5-5 OZ |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
