Base Material | FR4 |
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Application | Electronics Device |
Number Of Layers | 1- 24 Layers |
Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
PCB QC | Electrical Testing,Flying Probe Tester |
Place Of Origin | Guangdong, China |
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Supplier Type | PCB Assembly Manufacturer |
Copper Thickness | 3 Oz |
Solder Mask Color | Blue.green.red.black.white |
Surface Finishing | HASL\OSP\immersion Gold |
Place Of Origin | Guangdong, China |
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Base Material | FR-4, Fr-4,cem-1,cem-3 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 1.6mm-3.2mm |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Copper Thickness | 1oz |
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Base Material | FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 1.6mm-3.2mm |
Min. Line Width | 0.2mm |
Base Material | FR4 |
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Layers | 2~40 Layers |
Board Thickness | 0.2mm-6mm |
Min. Hole Size | 0.1-6.5mm |
Min. Line Width | 3mil |
Type | FPC |
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Place Of Origin | Guangdong, China |
Base Material | FR4,Aluminum,High Tg FR4 |
Copper Thickness | 0.5-1oz |
Board Thickness | 0.4-4.0mm |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Combining Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy |
Base Material | FR4 (Tg130~Tg170) |
Insulation Materials | Epoxy Resin |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | FR4/CEM-1/CEM-3/FR1/aluminum |
Copper Thickness | 3oz |
Board Thickness | 2mm |