Global Well Electronic Inc. is a professional PCB solution supplier from Shenzhen, China, integrating PCB circuit board production and processing, STM processing and mounting, PCBA OEM, component purchasing, PCB/PCBA custom design-production- A comprehensive PCB circuit board company with one-stop turnkey service of processing-assembly-finished products. The company has a strong supply chain system, a professional and efficient collaborative team, a sound and complete quality control system, and the business philosophy of honesty and trustworthiness, customer first, and presents the products to everyone with low prices, reliable quality, high-quality service and after-sales service. client.
We provide total PCB solutions from PCB design to final mass production, including PCB fabrication and assembly, component sourcing, solder paste stencils, conformal coatings, and more. Serving the global electronics field, including industrial control, medical electronics, military equipment, power communication, automotive electronics, AI artificial intelligence, smart home and other industries.
Our factory located in Shenzhen, and have almost 300 employees, more than 30 production lines include SMT, DIP, automatic welding, aging test and assembly. We have SMT machines from Japan and Korea, automatic solder paste printing machines, solder paste inspection machine(SPI)12 temperature zone reflow soldering machine, AOI detector, X-RAY detector, wave soldering machine, EM PCB ,dispenser,laser print machine etc., Different line configurations can meet requirements from small sample order to bulk shipment.
Our company has obtained ISO 9001 quality system certification and ISO 14001 system certification. With multi-testingprocedures, our products carry out the quality system standard strictly.
1. PCB fabrication.
2. Turnkey PCBA: PCB+components sourcing+SMD and through-hole assembly
3. PCB clone, PCB reverse engineering.
PCB or PCBA Files Requests:
1. Gerber files of the bare PCB board
2. BOM (Bill of material) for assembly (please kindly advise us if there is any acceptablecomponents substitution.)
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Schematic if necessary
| Order Quantity | 1-300,000,30000 Square Meter/Square Meters per Month module electronic board |
| Layer | 1,2,4,6,upto 40 layer |
| Material | FR-4,glass epoxy,FR4 High Tg,Rohs compliant,Aluminum,Rogers,etc |
| PCB type | Rigid,flexible,rigid-flexible |
| Shape | Any shape: Rectangular,round,slots,cutouts,complex,irregular |
| Max PCB dimensions | 20inch*20inch or 500mm*500mm |
| Thickness | 0.2~4.0mm, Flex 0.01~0.25'' |
| Thickness tolerance | ± 10% |
| Copper thickness | 0.5-4 oz |
| Copper thickness tolerance | ± 0.25oz |
| Surface finish | HASL,Nickle,Imm Gold,Imm Tin,Imm Silver,OSP etc |
| Solder mask | Green, red,white,yellow,blue,black, Double-sided |
| Silk screen | White,yellow,black,or negative, Double-sided or single-sided |
| Silk screen min line width | 0.006'' or 0.15mm |
| Min drill hole diameter | 0.01'',0.25mm.or 10 mil |
| Min trace/gap | 0.075mm or 3mil |
| PCB cutting | Shear,V-score,tab-routed |
| Turnkey PCBA | PCB+components sourcing+assembly+package |
| Assembly details | SMT and Thru-hole, ISO lines |
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
| Components: Bill of Materials(BOM list) | |
| Assembly: Pick-N-Place file | |
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
| Max size: 20*20 inches(500*500mm) | |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
| PCBA process |
Drilling-----Exposure-----Plating-----Etaching Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature - Humidity Testing |
Packing details:
PCBA are packed into plastic bags. Plastic bags are put into small carton. 4 small carton into a big carton.
A big carton: 35×32×40 cm size.
Shipping Express:
FedEx, DHL, UPS, TNT, EMS, private lines, etc.
Air freight, Sea shipping
If you need help on PCB layout, you can contact us and send the board to us. We also provide Reverse Engineering Service.
We have been providing PCB Manufacture for many years in China,and we have rich experience in product production and product assembly.We believe our team will provide high quality and low cost service for you.
Thank you very much for all your support .
Best Regareds.
Why use ceramics material to produce circuit boards? Ceramic circuit boards are made of electronic ceramics and can be made in various shapes. The characteristics of high-temperature resistance and high electrical insulation of ceramic circuit boards are the most prominent. The advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to components are also significant. The production of ceramic circuit boards will use LAM technology, which is laser rapid activation metallization technology. They are used in the LED field, high-power power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, smart power components, high-frequency switching power supplies, solid-state relays, automotive electronics, communications, aerospace, and military electronics components.
Unlike traditional FR-4, ceramic materials have good high-frequency performance and electrical performance, have high thermal conductivity, chemical stability, excellent thermal stability, and other properties that organic substrates do not have. It is a new ideal packaging material for the generation of large-scale integrated circuits and power electronic modules.
Main advantages:
