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IPC-III Standard PCB Circuit Board Assembly Smart Watch 0.076mm Buried Cpacitor

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IPC-III Standard PCB Circuit Board Assembly Smart Watch 0.076mm Buried Cpacitor
Features Gallery Product Description Request A Quote
Features
Specifications
Model Number:: GW-0258
Type:: Smart Electronics Pcba
Brand Name:: OEM/ODM
Supplier Type:: Factory/Manufacturer
Certificate:: ISO/TS16949/RoHS/TS16949
Layer:: 1-24 Layers
Solder Mask:: Green Black Bule White
Silkscreen Color:: White Black
PCB Standard:: IPC-A-610 D/IPC-III Standard
Hole Tolerance:: PTH: ±2mil, NTPH: ±2mil
Board Thickness Tolerance:: ±10%
Layer: 1-40 Layer
High Light:

IPC-III PCB Circuit Board Assembly

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PCB Circuit Board Assembly 0.076mm

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Circuit Board Assembly Buried Cpacitor

Basic Infomation
Place of Origin: Guangdong, China
Brand Name: GW-PCBA
Certification: ISO/TS16949/RoHS/TS16949
Model Number: GW-0258
Payment & Shipping Terms
Packaging Details: Vacumn packing for bare board, standand cartons outside for shipping
Delivery Time: PCB 3-7dyas, PCBA 1-3weeks/1 - 1000 -15days;1001 - 5000-20days;5001 - 20000-35days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000 Square Meter/Square Meters per Month module electronic board
Product Description
Product Description
Electronic Pcba Manufacturer Smart Watch Pcb Circuit Board Assembly
Technology Capabilities
Layer 1~22L
Min.inner Layer Trace 0.076mm
Min.inner layer Space 0.076mm
Min.outer Layer Trace 0.076mm
Min.outer Layer Trace 0.076mm
Max.inner layer copper Thickness 6oz
Max.outer layer copper Thickness 14oz
Layer to Layer registration tolerance <10L +/-0.076mm
Layer to Layer registration tolerance >10L +/-0.125mm
Max.Finished board thickness 8mm
Min.Finished board thickness 0.3mm
Min.Core Dielectric thickness 0.051mm
Min.Impedance-Differential +/-5%
HDI Stack up 1+N+1,2+N+2,3+N+3
Controlled Depth Drilling Tolerance +/-0.1mm
Advanced Buried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base
Max Production Panel Size 24.5"*43"
Via in PAD YES
BGA Pitch(with trace) 0.4mm
Soldermask Registration +/-0.03mm
Min.Solder Dam 0.064mm
Min.Drilled Hole size-Mechanical 0.2mm
Min.Drilled Hole size-Laser 0.1mm
Max.Laser Drill Aspect Ratio 20:01
Press Fit Hole +/-0.05mm
Layer To layer Registration Tolerance 0.04mm
Min.Dielectric Thickness 0.04mm
Controlled Depth Drilling YES
BGA Pitch(with trace) 0.5mm
surface Finishing ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold,
Materil Normal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminate

 

Electronic pcba manufacturer smart watch pcb circuit board assembly

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Electronic pcba manufacturer smart watch pcb circuit board assembly

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Contact Person : Guo
Tel : +8613418764280
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