| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Insulation Materials | Metal Composite Materials |
| Processing Technology | Electrolytic Foil |
| Place Of Origin | Guangdong, China |
|---|---|
| Copper Thickness | 1 Oz |
| Base Material | Polyimide |
| Min. Line Width | 0.1mm |
| Board Thickness | 1.6mm |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| FPC Layer | 1-8 Layers |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Min. Hole Size | 0.20mm |
| Surface Finish | ENIG |
|---|---|
| Material | Flexible PCB |
| Min. Line Width | 0.1mm |
| Copper Thickness | 1oz |
| Layer | 2-layer |
| Board Thickness | 1.6mm |
|---|---|
| Material | Flexible PCB |
| Surface Finish | ENIG |
| Silk Screen Color | White |
| Min. Line Spacing | 0.1mm |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width | 0.1mm |
| Surface Finish | ENIG |
| Min. Line Spacing | 0.1mm |
| Material | Flexible PCB |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Model Number | Custom PCB & PCB Assembly |
|---|---|
| Supplier Type | OEM |
| Product Name | Mechanical Keyboard |
| Capacity | Hotswap, USB Type-C, Kailh Socket, LED |
| Speed | 0.15sec/chip,0.7sec/QFR |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Base Material | FR-4 |
