Type | Ceramic PCB Manufacturer |
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Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Model NO. | Rigid-Flex Board |
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Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Epoxy Resin |
Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
Model Number | PCBA-0606 |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Copper Thickness | 1 Oz |
Board Thickness | 1.6mm |
Place Of Origin | Guangdong, China |
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Type | Multilayer PCB |
Number Of Layers | 1- 24 Layers |
Base Material | FR-4 |
Copper Thickness | 1oz |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
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Min. Line Spacing | 0.1mm/4mil |
Min. Hole Size | 0.1mm-1mm |
Surface Finishing | HASL,Gold Plating |
Product Name | Electronic Boards |
Model Number | OEM/ODM/EMS |
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Place Of Origin | Guangdong, China |
Base Material | FR-4 |
Surface Finishing | HASL Lead Free |
Layer | 1-40 Layer |
Type | Rigid Circuit Board |
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Processing Technology | Electrolytic Foil |
Base Material | FR-4 |
Surface Finishing | HASL Lead Free |
Copper Thickness | 1oz |
Color Of PCB | Green、Black 、Orange、Blue、Customized |
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Connector | Type C、USB、Micro USB |
Base Material | Fr4/Customized |
Surface Finishing | HASL Lead Free |
Copper Thickness | 1oz |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
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Base Material | CEM-1 OR FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 0.5~3.2mm |
Min. Line Width | 0.1mm/4mi |
Model NO | Double Sided PCB-4 |
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Base Material | Fr-4 |
Insulation Materials | Organic Resin |
Model | FR-4 |
Surface | OSP,Immersion Gold,Hal Lead Free,Hal |